Industrial R&D
NANOFABRICATOR™ PRO
Empowering material innovation and prototyping with multi-material sequential deposition and unmatched sample versatility levating industrial capabilities. Discover the power of advanced micro- and nano-scale fabrication.
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Up to 6 Materials simultaneously
Deposition speed up to 500 mm/s
Sequential deposition of up to 6 materials. 6 different precursors and 6 different reactants can be loaded at the same time, allowing you to quickly switch between the materials you wish to deposit or test.
Samples size up to 200mm. The stage of NANOFABRICATOR™ PRO can accommodate wafers up to 8” and other shapes under 200×200 mm.
Rapid deposition. The NANOFABRICATOR™ PRO stage can move up to 500mm/s, with a deposition speed dependent on the sample and process specifications.
Advanced Microfabrication
RAPID, FLEXIBLE, VERSATILE & ATOMICALLY PRECISE PROCESSING
At the heart of the NANOFABRICATOR™ PRO is the Direct Atomic Layer Processing (DALP®) technology, a breakthrough in nanoscale engineering. This technology allows for atomic-scale precision, enabling the creation of materials and devices with unprecedented accuracy and complexity.
It is designed for rapid prototyping and the development of new device structures, offering a wide selection of materials for Atomic Layer Deposition (ALD) processes. Additionally, its lithography-less single-wafer optimization significantly streamlines the fabrication process, making it an ideal tool for innovative and efficient prototype development in various scientific and industrial fields.
DALP® has revolutionized prototyping, turning a traditionally lengthy process into a rapid, precise operation. Key benefits include accelerated development cycles, atomic-level control for complex prototypes, versatile material and surface adaptability, and cost reductions due to increased efficiency. This advancement in DALP® fosters a conducive environment for innovative microdevice fabrication, marking a significant leap in microfabrication technology.
Nanofabricator™ PRO
Technical Specification
- Size: up to 8″ (200mm)
- Substrate Handling: Wafer
- Maximum thickness: 10 mm
- Z direction shape: Flat
- Holding method: Vacuum
- Loading: Manual
- Heater temperature: max. 300°C
- Heater temp. uniformity: +/- 0.5%
- Environment: Inert***** Controlled
- Processing speed****: up to 500mm/sec
- Deposition area: up to 1.5mm from wafer edge
- DALP® resolution: 100 μm standard
- Precursor temperature: RT – 150°C
- Nr. of precursor bubblers: 2**
- Nr. of reactant bubblers: 1** (H2O***)
- Nr. of gas reactants: 1**
- Additional precursor bubblers: **
- Additional reactant bubblers: **
- Additional gas reactants: **
* Dependent on materials to be deposited and customer needs.
** Additional number of bubblers and reactants dependent on customer needs
*** Additional reactant types dependent on customer needs.
**** Clean room, CLASS 8 min recommended.
Questions & Answers
The NANOFABRICATOR™ PRO, a flagship product from ATLANT 3D, represents a significant leap in advanced material innovation and nanofabrication technology. Designed to accommodate a diverse range of materials and sample sizes, it offers unparalleled flexibility and precision in atomic layer deposition.
DALP®, or Microreactor Direct Atomic Processing, is a hybrid technology enabling on-demand atomic layer manufacturing. It allows for precise printing of microdevices on various surfaces, offering functionality and speed at a reduced cost.
It’s ideal for applications in MEMS & Sensors, Optics, Photonics & Novel Displays, Advanced Packaging, RF & Microelectronics, and Emerging Applications.
Yes, it incorporates both Temporal ALD, which involves sequential pulse sequences for precursor and co-reagent delivery, and Spatial ALD, which offers spatial separation of these elements with increased deposition speed.
Yes, it is capable of processing on diverse substrates like Silicon/SiC/GaN Wafers, Polymers, Glass, Fused Silica, and Borosilicates.
Yes, the NANOFABRICATOR™ PRO is designed to be flexible and can be adapted to specific project requirements.
The system offers atomic scale thickness variability and precise gradient control for accurate material deposition.
It is designed to seamlessly integrate into lab infrastructures.
ATLANT 3D offers comprehensive support for the NANOFABRICATOR™ PRO, including training and technical assistance.
Capabilities
The NANOFABRICATOR™ PRO equipped to handle sequential deposition of up to six materials with rapid switching capabilities, the NANOFABRICATOR™ PRO can support sample sizes up to 200×200 mm and wafers up to 8 inches. Its advanced features, such as a high-speed stage capable of moving up to 500mm/s and a finely-tuned heating system with exceptional temperature uniformity, make it an ideal tool for cutting-edge research and development in microelectronics, photonics, and beyond.
The NANOFABRICATOR™ PRO excels in rapid material testing, enabling precise exploration of new materials and swift development of innovative processes, crucial for cutting-edge research and development.
It facilitates the development of complex device structures by allowing multi-material deposition in a single process. This feature is vital for industries like semiconductor manufacturing and photonics, where intricate device architectures are commonplace.
Yes, it is equipped to handle a variety of precursor gases, essential for diverse material processing. This versatility is key in experimenting with new material combinations and properties.
The NANOFABRICATOR™ PRO supports sequential up to 6 materials simultaneously. It is equipped to load six different precursors and six different reactants simultaneously, enabling quick transitions between various materials for deposition or testing.
The NANOFABRICATOR™ PRO can accommodate wafers up to 8 inches (200×200 mm), as well as other shapes within these dimensions.
The deposition speed is dependent on the sample and process specifications. The stage can move up to 500mm/s, offering rapid deposition capabilities.
The NANOFABRICATOR™ PRO is designed for wafers ranging in size from 2 inches to 8 inches, with a maximum thickness of 10 mm. The Z-direction shape of the wafers should be flat.
Samples are held in place through a vacuum holding method, ensuring stability during the deposition process.
It features a heater with a maximum temperature of 300°C. The heater temperature uniformity is maintained within +/- 0.5% to ensure consistent processing conditions.
It offers a DALP® resolution of 100 μm, allowing for detailed and precise deposition.
Yes, it is capable of handling wafers up to 200mm (8 inches) in diameter.
Operations & Control
The NANOFABRICATOR™ PRO is sophisticated system sets a new standard in nanoscale engineering, embodying ATLANT 3D’s commitment to pioneering innovations in the realm of atomic-scale manufacturing.
The NANOFABRICATOR™ PRO operates with proprietary software designed to control its advanced features and functionalities.
The integrated software is essential for optimizing the deposition processes, enabling precise control over parameters such as material flow, deposition rates, and layer thickness. It may also include analytical tools for process evaluation and improvement.
The system could be configured for remote monitoring and possibly control, depending on user requirements and security considerations.
Emerging applications like quantum computing, advanced sensors, and next-generation energy storage technologies can significantly benefit from the precision and versatility offered by the NANOFABRICATOR™ PRO.
The ability to operate in an ambient environment allows for more flexible and practical integration into various research and production settings, reducing the need for specialized controlled environments.
Absolutely, its design caters to both R&D labs and production lines, offering flexibility in scaling from prototype development to full-scale production.
We are providing ongoing support, including operational training, technical assistance, and maintenance services, ensuring customers can fully leverage the capabilities of the NANOFABRICATOR™ PRO.
