Public Funding Projects
Collaborative approach to value creation. Advanced nanotechnology collaboration projects where innovation meets precision.
Collaborative Projects
Exploring Advanced Nanotechnology Collaborations
Explore our projects to discover how ATLANT 3D is driving innovation, enhancing manufacturing capabilities, and fostering sustainable and smart solutions for a better future.
Our portfolio features groundbreaking work in advanced manufacturing of microelectronics, supported by EU Commission, EU Chip Act, European Space Agency, and others. Each project reflects our commitment to pushing the boundaries of atomic-layer printing, micro-optoelectronics, and smart sensors.
From developing cutting-edge machinery for hybrid technologies in the MESOMORPH project to pioneering atomic layer processing in the Gap4DALP initiative, we are actively shaping the future of nanofabrication. Our projects like WISE and ARI Hub demonstrate our dedication to revolutionizing product complexity and contributing to the semiconductor industry’s growth.
Project
CLOSER: Circular raw materials for European Open Strategic autonomy on chips and microlectronics production
Partners
Universita Degli Studi Di Roma Tor Vergata, Holland Circular Hotspot, VELTHA IVZW, Universita Degli Studi Della Tuscia, ERP Italia Servizi SRL, DUE2LAB S.R.L. (DUE2LAB), Circular Industries BV, SWEGAN AB, Leonardo – Societa Per Azioni, Selcom Group S.P.A., ForkBomb BV, Green Blue Modern Solutions PC, Interuniversitair Micro-Electronica Centrum (IMEC), Politecnico Di Milano, Clust-ER Meccatronica E Motoristica (CLUSTERMM), Associazione Fabbrica Intelligente Lombardia, Feragame, Lorusso Estrazione SRL, UAB Fivrec, Closing The Loop BV, R.A.I.T 88 SRL, Freiberger Compound Materials GmbH (Freiberger), Universita Telematica Pegaso S.R.L., Calabria Regione, Smart Photonics BV, Fraunhofer, World Business Council For Sustainable Development (WBCSD), Ruhr-Universitaet Bochum, Soltech, Dockweiler Chemicals GmbH
Scope
CLOSER is focused on establishing a European circular supply chain for semiconductor raw materials. The project addresses Europe’s critical dependence on external sources for strategic materials like silicon, gallium, indium, and germanium by reclaiming and repurposing these materials from e-waste and industrial waste. CLOSER aims to create a sustainable and resilient solution to support microelectronics production within Europe. Through innovative processes such as urban mining and advanced recycling methods, the project reduces reliance on raw material imports and supports the EU’s strategic autonomy in semiconductor manufacturing. This initiative is vital to industries such as automotive, aerospace, renewable energy, health, and computing.Â
ATLANT 3D contributes to the CLOSER project by leveraging our DALP technology to enable the precise and scalable deposition of recovered materials onto functional platforms. Technology plays a critical role in transforming reclaimed semiconductor raw materials into functional components for advanced microelectronics and ensuring their high purity and performance. ATLANT 3D’s expertise bridges the gap between material recovery and real-world industrial applications by facilitating the development of secondary semiconductor devices and supporting next-generation microfabrication solutions.Â
Project
ACES: Advanced Contact Engineering and Surface Passivation for Solar Cells
Partners
Danish Technical University (DTU), Swiss Center for Electronics and Microtechnology (CSEM), Aarhus University, Elplatek, Meyer BurgerÂ
Scope
ACES focuses on improving the performance and cost-effectiveness of silicon solar cells. The project addresses two critical challenges in the photovoltaic (PV) industry: replacing expensive silver with copper in solar cell metallization and developing a new technique for selective edge passivation. These advancements will enhance cell efficiency, reduce production costs, and accelerate the adoption of sustainable energy solutions.Â
ATLANT 3D contributes to ACES with our DALP technology. The DALP platform allows for the localized and selective deposition of materials at the atomic scale, making it ideal for creating narrow diffusion barriers and seed layers essential for copper metallization. In the project, ATLANT 3D develops and demonstrates the technology to deposit precision copper contacts and advanced dielectric materials for edge passivation, ensuring minimal recombination losses and maximum conductivity. By enabling localized, high-precision material deposition, ATLANT 3D’s solution overcomes the limitations of conventional silver screen-printing techniques and supports the transition to cost-effective, copper-based solar cells. This innovation not only improves solar cell efficiency but also addresses sustainability concerns by reducing reliance on rare and costly materials like silver.Â
Project
AMUSENS: Adaptable multi-pixel gas sensor platform for a wide range of appliance and consumer market
Partners
Luxembourg Institute of Science and Technology (LIST), Technikon Forschungs– Und Planungsgesellschaft Mbh, Science for Change, Universite De Liege, Jlm Innovation Gmbh, Universita Degli Studi Di Brescia, Institut Mines-Telecom, Sciosense Germany Gmbh, Ellona SasÂ
Scope
AMUSENS aims to develop a new adaptable gas sensor platform and an innovative manufacturing method to meet the growing demand for low-cost, high-performance gas sensors in consumer and appliance markets. The project addresses the limitations of existing technologies by enabling the precise deposition of multiple sensing materials, improving selectivity and adaptability for a wide range of applications.Â
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ATLANT 3D contributes to AMUSENS through our proprietary DALP technology. This advanced method allows for localized, high-precision deposition of metal oxide sensing materials directly onto micro-hotplate platforms. By enabling on-demand material combinations, DALP technology supports the development of multi-material gas sensors with improved performance, efficiency, and scalability. ATLANT 3D plays a central role in demonstrating the feasibility of wafer-scale production for these multi-material devices, making it possible to bridge the gap between laboratory research and industrial-scale manufacturing.Â
Project
CERMETAD
Partners
Fraunhofer IKTS (Germany), IRCER (France), DTU (Denmark), and ATLANT 3D (Denmark).
Scope
The project aims to push the boundaries of wireless communication technologies by developing innovative solutions for controlling electromagnetic waves. The main objective of CERMETAD is to create reconfigurable intelligent surfaces (RIS), a crucial component for future 5G and 6G wireless communication networks. These programmable surfaces will be designed using advanced metamaterials, enabling precise control of electromagnetic waves. By integrating phase-changing materials such as vanadium dioxide and germanium-antimony-tellurium, the project seeks to develop surfaces that can dynamically optimize the reflection and transmission of signals, addressing the challenges of communication frequencies.
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Project
InnoBooster: Multi-head DALP system for enhanced throughputÂ
Funding
Innovation Fund Denmark
Scope
ATLANT 3Dpioneered Direct Atomic Layer Processing (DALP®) for micro-/nanofabrication, addressing current limitations of the field with cost efficiency, material diversity, and atomic-level resolution. Building on this success, ATLANT 3D seeks to develop a multi-head DALP® system to meet the industry’s need for greater throughput, enhancing efficiency and flexibility, reducing production costs, and meeting the rising demand for micro/nano-products in a dynamic market.Â
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Project
ESA BIC & ESA Idea
Scope
Building the 2nd generation of Nanofabricator 0g. The project focuses on various design and testing phases, including norms review, gas system design, and laboratory testing in simulated ISS environments​​.
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Project
ATOSENS
Partners
Institute of Electrical Engineering Slovak Academy of Sciences (IEE SAS) (coordinator), National Yang Ming Chiao Tung University, Comenius University Bratislava.
Scope
Exploring atomic-layer 3D printing for smart sensors. This project focuses on developing TiO2-based hydrogen sensing elements and a smart hydrogen sensor with in-sensor data processing​.
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Project
Gap4DALP
Partners
Danish Fundamental Metrology A/S (DNK); Avantes b.v. (NLD)​.
Scope
Developing a breakthrough Direct Atomic Layer Processing (DALP®) technology for precise advanced manufacturing. The project aims to revolutionize the micro/nanofabrication sector with a cost-effective, fast, and environmentally friendly all-in-one fabrication machine​​.
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Project
WISE
Partners
Prima Additive Srl (Coordinator), Iris Srl; Amplitude; Alite Srl; Morphica Srl; Idryma Technologias Kai Erevnas; Foto-katalytika Nano Ylika I.k.e.; Politecnico Di Torino; Hogskolan Vast; Gkn Aerospace Sweden Ab; Neos Surgery Sl; Hydro Alps; Scuola Universitaria Professionale Della Svizzera Italiana; Femtoprint Sa; Mch-tronics Sagl​.
Scope
Creating a multi-scale, multi-process machine for high value-added products with disruptive functionalities. WISE focuses on integrating advanced AI engineering and manufacturing techniques to produce complex multifunctional products in various sectors​​.
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Project
ARI HUB
Scope
Supporting the Silicon Heartland Microelectronics Commons Hub. This involves participating in innovation sessions and helping develop plans for research and development in the semiconductor industry​​.
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Project
Advanced Packaging for RF Modules
Partners
Thales Alenia Space (TAS) (coordinator), UMS​.
Scope
Addressing key themes in the space economy, such as climate change, security, and telecoms. The project will develop advanced packaging technologies and a new concept for high integration, high thermal, and RF performance modules​​.
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OUR ACHIEVEMENTS
Completed Projects
Rapid atomic layer 3D printer for microelectronics
ATLANT 3D Atomic Layer Nanoprinter for rapid micro- and nanoprototyping of complex multi-material 2D/3D structures with high-resolution
ATLANT 3D – the first 3D printer for micro and nanofabrication, handling 450+ materials
ATLANT 3D – the first 3D printer for micro and nanofabrication, handling 450+ materials
AWARDS & RECOGNITION
HELLO TOMORROW GRAND WINNER 2021
3D PIONEERS CHALLENGE WINNER
FALLING WALLS WINNER 2020
ROYAL SOCIETY OF CHEMISTRY FINALIST 2020
WINNER STARTUP CONTEST 2021
