DALP® (Direct Atomic Layer Processing) is transforming the semiconductor industry by dramatically accelerating the transition from ideas to prototypes. This innovative technology enables the creation of complex shapes and material applications previously considered unattainable, by allowing for rapid testing and material exploration.
Explore how ATLANT 3D’s DALP® technology is revolutionizing the fabrication of hyperspectral filters. This whitepaper delves into the advantages of atomic-level precision and material compatibility, offering a scalable solution for various applications, including biomedicine, agriculture, and environmental monitoring.
Revolutionize your microfabrication processes with ATLANT 3D’s “Chip Surgery” using our pioneering DALP® technology. Discover how we are transforming microfabrication by enabling precise, rapid repairs during the deposition process, drastically reducing downtime and resource waste.
ATLANT 3D’s latest innovation allows for platinum deposition without a reactant, offering greater flexibility and efficiency in thin film deposition processes. Our technology enhances flexibility, reduces material costs, and speeds up the deposition process, making it a valuable tool for research and development in advanced materials.
Direct-Patterning ZnO Deposition by Atomic-Layer Additive Manufacturing Using a Safe and Economical Precursor
Area-selective atomic layer deposition (AS-ALD) is a bottom-up nanofabrication method delivering single atoms from a molecular precursor. AS-ALD enables self-aligned fabrication and outperforms lithography in terms of cost, resistance, and equipment prerequisites, but it requires pre-patterned substrates and is limited by insufficient selectivity and finite choice of substrates.
Authors: Sonja Stefanovic, Negar Gheshlaghi, David Zanders, Ivan Kundrata, Baolin Zhao, Maïssa K. S. Barr, Marcus Halik, Anjana Devi, Julien Bachmann
Additive manufacturing in atomic layer processing mode
The invention of atomic-layer additive manufacturing (ALAM): In ALAM, controlled surface chemistry is performed with spatially constrained flows of molecular precursors delivered to the substrate from a microfluidic nozzle. Each pass of the nozzle over any point of the substrate deposits one monolayer of solid. Repeated passes allow for direct patterning deposition of functional materials with Angström vertical resolution.
Authors: Ivan Kundrata, Maïssa K. S. Barr, Sarah Tymek, Dirk Döhler, Boris Hudec, Philipp Brüner, Gabriel Vanko, Marian Precner, Tadahiro Yokosawa, Erdmann Spiecker, Maksym Plakhotnyuk, Karol Fröhlich, Julien Bachmann.
The invention relates to an atomic layer process printer for material deposition, etching and/or cleaning on an atomic scale in a selective area. The invention further relates to a method for material deposition, etching and/or cleaning on an atomic scale in a selective area using the atomic layer process printer.
